China International Packaging Products & Materials Expo (CIPPME) 2027

About China International Packaging Products & Materials Expo (CIPPME)

China International Packaging Products & Materials Expo (CIPPME / PACK FAIR 2027), held June 2-4, 2027 at Shanghai World Expo Exhibition & Convention Center, showcases packaging products, packaging materials, printing technology, green packaging solutions, and sustainable packaging innovations. PACK FAIR connects packaging material suppliers, printing companies, F&B brands, e-commerce platforms, and logistics firms.

何を期待するか

• 最新の製品革新や、最先端の技術
• ビジネスマッチングや専門家間のネットワーク構築に関するセッション
• 業界向けのセミナー、会議、技術ワークショップ

会場とスケジュール

Held at Shanghai World Expo Exhibition & Convention Center, Shanghai, this exhibition provides a comprehensive platform for exploring new business opportunities.

官方信息

For more details, visit the website of Food Taipei以前のURLパス.

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参展或展位注册

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场馆地图和周边酒店

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